About this role
Number of Positions: 1
Date: Jan 2027 - Apr 2027
Duration: 4 months
Location: Onsite in Sunnyvale, CA or New York, NY
EDUCATIONAL RECOMMENDATIONS
Current M.S. or Ph.D. student in mechanical engineering, physics, or other similar fields or related field with an accredited school in US.
- Experience with 3D CAD design, tolerance analysis, and GD&T with SolidWorks or similar software.
- Experience with thermal and thermo-mechanical simulations using ANSYS or similar software.
- Experience with documentation of fabrication, inspection, and assembly processes.
- Solid interpersonal, communication and problem-solving skills in order to interact with engineering staff, external vendors and contractors effectively.
It would be nice if you also had:
- Knowledge of design for manufacturing of 2.5D/3D packaging.
- Experience in high-speed electronics package design and/or laser package design.
- Experience with metrology techniques such as SEM/XSEM, confocal microscopy, or acoustic imaging - or equivalent practical work experience.
- Familiarity with design and simulations of optical packaging using free space optics or fiber coupling.